MIZIAN, Z. Development of an Electronic Brick Bonding Module Using the Autocad Program for Students. Tekno - Pedagogi : Jurnal Teknologi Pendidikan, [S. l.], v. 13, n. 2, p. 35-43, 2023. DOI: 10.22437/teknopedagogi.v13i2.32531. Disponível em: https://online-journal.unja.ac.id/pedagogi/article/view/32531. Acesso em: 31 jan. 2025.