Analisis Korelasi Pearson Total Unit Printed Circuit Board Assembly (PCBA) Good In Circuit Testing (ICT)

Authors

  • Puri Rahayu Nengsi Program Studi Matematika, Fakultas Teknologi Informasi, Institut Teknologi Batam, Batam 29425, Indonesia
  • Andini Setyo Anggraeni Program Studi Matematika, Fakultas Teknologi Informasi, Institut Teknologi Batam, Batam 29425, Indonesia
  • Widya Reza Program Studi Matematika, Fakultas Teknologi Informasi, Institut Teknologi Batam, Batam 29425, Indonesia

DOI:

https://doi.org/10.22437/msa.v4i1.28508

Keywords:

In Circuit Testing, Pearson correlation analysis, PCBA

Abstract

Every job always faces challenges or problems from various aspects, one of the problems was related to PT PCI Elektronik Internasional's production target for In Circuit Testing (ICT), which aims to achieve 90% of the total ICT units as good product, it means that the minimum percentage of ICT units that must be good is 90% to achieve this target. However, not all units can be classified as 100% good. The quality of the ICT unit depends on the condition of the Printed Circuit Board Assembly (PCBA) and the testing machine. This research will analyze the relationship between the total PCBA good ICT units in May and June 2023 using correlation analysis. Based on the results of correlation analysis using the Pearson method, a correlation coefficient value of 0.843 was obtained between the total PCBA good ICT units in May 2023 and the total PCBA good ICT units in June 2023. The correlation value of 0.843 indicates that there is a strong positive linear relationship between the total PCBA good ICT units in May and June 2023.

Downloads

Download data is not yet available.

References

Jabnabillah, F., & Margina, N. 2022. Analisis Korelasi Pearson Dalam Menentukan Hubungan Antara Motivasi Belajar Dengan Kemandirian Belajar Pada Pembelajaran Daring. Jurnal Sintak, 1(1), 14-18.

Safitri, W. R. 2016. Pearson correlation analysis in determining the relationship between the incidence of dengue hemorrhagic fever and population density in the city of Surabaya in 2021-2014. Journal of Public Health, 16, 21–29.

Budiwati, T., Budiyono, A., Setyawati, W., & Indrawati, A. 2010. Analisis Korelasi Pearson untuk Unsur-Unsur Kimia Air Hujan Di Bandung. Jurnal Sains Dirgantara, 7(2), 100–112.

Guo, Y., Liu, M., Yin, M., & Yan, Y. 2022. Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process. Mathematics, 10(17), 3055. https://doi.org/10.3390/math10173055.

Fu, T., Tang, X., Cai, Z., Zuo, Y., Tang, Y., & Zhao, X. 2020. Correlation research of phase angle variation and coating performance by means of Pearson’s correlation coefficient. Progress in Organic Coatings, 139(June 2019), 105459. https://doi.org/10.1016/j.porgcoat.2019.105459.

Zhang, Y., Li, Y., Song, J., Chen, X., Lu, Y., & Wang, W. 2020. Pearson correlation coefficient of current derivatives-based pilot protection scheme for long-distance LCC-HVDC transmission lines. International Journal of Electrical Power and Energy Systems, 116(August 2019), 105526. https://doi.org/10.1016/j.ijepes.2019.105526.

Aguilar-Calderón, J. A., Zaldívar-Colado, A., Tripp-Barba, C., Espinoza-Oliva, R., & Zurita-Cruz, C. E. 2019. A Pearson Correlation Analysis of the Software Engineering Practice in Micro and Small-Sized Software Industry of Sinaloa, Mexico. IEEE Latin America Transactions, 17(02), 210-218. https://doi.org/10.1109/TLA.2019.8863166

Downloads

Published

2023-10-31

How to Cite

Nengsi, P. R., Anggraeni, A. S., & Reza, W. (2023). Analisis Korelasi Pearson Total Unit Printed Circuit Board Assembly (PCBA) Good In Circuit Testing (ICT). Mathematical Sciences and Applications Journal, 4(1), 8-12. https://doi.org/10.22437/msa.v4i1.28508